About Barcode Numbers
This mail is very useful to know about BAR-CODE.
Dear all friends,
The whole world is scared of China made "black hearted goods" Can you differentiate which one is made in Taiwan or China? Let me tell! u � the first 3 digits of barcode 690.691.692 is made in CHINA. Do not ever buy it for your own health.
471 is Made in Taiwan
This is a human right to know, but the government and related department never educate the public, therefore we have to rescue ourselves. Remember.
00-13: USA & Canada
20-29: In-Store Functions
30-37: France
40-44: Germany
45: Japan (also 49)
46: Russian Federation
471: Taiwan
474: Estonia
475: Latvia
477: Lithuania
479: Sri Lanka
480: Philippines
482: Ukraine
484: Moldova
485: Armenia
486: Georgia
487: Kazakhstan
489: Hong Kong
49: Japan (JAN-13)
50: United Kingdom
520: Greece
528: Lebanon
529: Cyprus
531: Macedonia
535: Malta
539: Ireland
54: Belgium & Luxembourg
560: Portugal
569: Iceland
57: Denmark
590: Poland
594: Romania
599: Hungary
600 & 601: South Africa
609: Mauritius
611: Morocco
613: Algeria
619: Tunisia
622: Egypt
625: Jordan
626: Iran
64: Finland
690-692: China
70: Norway
729: Israel
73: Sweden
740: Guatemala
741: El Salvador
742: Honduras
743: Nicaragua
744: Costa Rica
746: Dominican Republic
750: Mexico
759: Venezuela
76: Switzerland
770: Colombia
773: Uruguay
775: Peru
777: Bolivia
779: Argentina
780: Chile
784: Paraguay
785: Peru
786: Ecuador
789: Brazil
80 - 83: Italy
84: Spain
850: Cuba
858: Slovakia
859: Czech Republic
860: Yugoslavia
869: Turkey
87: Netherlands
880: South Korea
885: Thailand
888: Singapore
890: India
893: Vietnam
899: Indonesia
90 & 91: Austria
93: Australia
94: New Zealand
955: Malaysia
977: International Standard Serial Number for Periodicals (ISSN)
978: International Standard Book Numbering (ISBN)
979: International Standard Music Number (ISMN)
980: Refund receipts
981 & 982: Common Currency Coupons
99: Coupons
With more and more milk products from China and Taiwan having problem. We really got to check where the things are produced. Here is a way to differentiate Taiwan made products and China made products : by looking at first three digits of its Bar Code.
If the 1st 3 digits are 690, 691 or 692 - China made
If the 1st 3 digits are 471 � Taiwan made
So please spread the words to everyone.... ..
Nowadays, China businessmen know the consumers do not prefer products "made in china", so they won't show made from which country. However, you may now refer to the barcodes, if the first 3 digits is 690-692 then it is made in China.
________________________________
http://askmanig.com/
Thursday, October 29, 2009
http://AskManig.com - Intel Shows How A PROCESSOR Is Made - Amazing process
Sand. Made up of 25 percent silicon, is, after oxygen, the second most abundant chemical element that's in the earth's crust. Sand, especially quartz, has high percentages of silicon in the form of silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing.
After procuring raw sand and separating the silicon, the excess material is disposed of and the silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called electronic grade silicon. The resulting purity is so great that electronic grade silicon may only have one alien atom for every one billion silicon atoms. After the purification process, the silicon enters the melting phase. In this picture you can see how one big crystal is grown from the purified silicon melt. The resulting mono-crystal is called an ingot.
A mono-crystal ingot is produced from electronic grade silicon. One ingot weighs approximately 100 kilograms (or 220 pounds) and has a silicon purity of 99.9999 percent.
The ingot is then moved onto the slicing phase where individual silicon discs, called wafers, are sliced thin. Some ingots can stand higher than five feet. Several different diameters of ingots exist depending on the required wafer size. Today, CPUs are commonly made on 300 mm wafers.
Once cut, the wafers are polished until they have flawless, mirror-smooth surfaces. Intel doesn't produce its own ingots and wafers, and instead purchases manufacturing-ready wafers from third-party companies. Intel's advanced 45 nm High-K/Metal Gate process uses wafers with a diameter of 300 mm (or 12-inches). When Intel first began making chips, it printed circuits on 50 mm (2-inches) wafers. These days, Intel uses 300 mm wafers, resulting in decreased costs per chip.
The blue liquid, depicted above, is a photo resist finish similar to those used in film for photography. The wafer spins during this step to allow an evenly-distributed coating that's smooth and also very thin.
At this stage, the photo-resistant finish is exposed to ultra violet (UV) light. The chemical reaction triggered by the UV light is similar to what happens to film material in a camera the moment you press the shutter button.
Areas of the resist on the wafer that have been exposed to UV light will become soluble. The exposure is done using masks that act like stencils. When used with UV light, masks create the various circuit patterns. The building of a CPU essentially repeats this process over and over until multiple layers are stacked on top of each other.
A lens (middle) reduces the mask's image to a small focal point. The resulting "print" on the wafer is typically four times smaller, linearly, than the mask's pattern.
In the picture we have a representation of what a single transistor would appear like if we could see it with the naked eye. A transistor acts as a switch, controlling the flow of electrical current in a computer chip. Intel researchers have developed transistors so small that they claim roughly 30 million of them could fit on the head of a pin.
After being exposed to UV light, the exposed blue photo resist areas are completely dissolved by a solvent. This reveals a pattern of photo resist made by the mask. The beginnings of transistors, interconnects, and other electrical contacts begin to grow from this point.
The photo resist layer protects wafer material that should not be etched away. Areas that were exposed will be etched away with chemicals.
After the etching, the photo resist is removed and the desired shape becomes visible.
More photo resist (blue) is applied and then re-exposed to UV light. Exposed photo resist is then washed off again before the next step, which is called ion doping. This is the step where ion particles are exposed to the wafer, allowing the silicon to change its chemical properties in a way that allows the CPU to control the flow of electricity.
Through a process called ion implantation (one form of a process called doping) the exposed areas of the silicon wafer are bombarded with ions. Ions are implanted in the silicon wafer to alter the way silicon in these areas conduct electricity. Ions are propelled onto the surface of the wafer at very high velocities. An electrical field accelerates the ions to a speed of over 300,000 km/hour (roughly 185,000 mph)
After the ion implantation, the photo resist will be removed and the material that should have been doped (green) now has alien atoms implanted.
This transistor is close to being finished. Three holes have been etched into the insulation layer (magenta color) above the transistor. These three holes will be filled with copper, which will make up the connections to other transistors.
The wafers are put into a copper sulphate solution at this stage. Copper ions are deposited onto the transistor through a process called electroplating. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer.
The copper ions settle as a thin layer on the wafer surface.
The excess material is polished off leaving a very thin layer of copper.
Multiple metal layers are created to interconnects (think wires) in between the various transistors. How these connections have to be "wired" is determined by the architecture and design teams that develop the functionality of the respective processor (for example, Intel's Core i7 processor). While computer chips look extremely flat, they may actually have over 20 layers to form complex circuitry. If you look at a magnified view of a chip, you will see an intricate network of circuit lines and transistors that look like a futuristic, multi-layered highway system.
This fraction of a ready wafer is being put through a first functionality test. In this stage test patterns are fed into every single chip and the response from the chip monitored and compared to "the right answer."
After tests determine that the wafer has a good yield of functioning processor units, the wafer is cut into pieces (called dies).
The dies that responded with the right answer to the test pattern will be put forward for the next step (packaging). Bad dies are discarded. Several years ago, Intel made key chains out of bad CPU dies.
This is an individual die, which has been cut out in the previous step (slicing). The die shown here is a die of an Intel Core i7 processor.
The substrate, the die, and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be applied. This will keep the processor cool during operation.
A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps and only the most important ones have been visualized in this picture story.
During this final test the processors will be tested for their key characteristics (among the tested characteristics are power dissipation and maximum frequency).
Based on the test result of class testing processors with the same capabilities are put into the same transporting trays. This process is called "binning". Binning determines the maximum operating frequency of a processor, and batches are divided and sold according to stable specifications.
The manufactured and tested processors (again Intel Core i7 processor is shown here) either go to system manufacturers in trays or into retail stores in a box. Many thanks to Intel for supplying the text and photos in this picture story. Check out Intel's site<http://www.intel.com/pressroom/kits/chipmaking/index.htm> for full size images of this entire process.
http://askmanig.com/
After procuring raw sand and separating the silicon, the excess material is disposed of and the silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called electronic grade silicon. The resulting purity is so great that electronic grade silicon may only have one alien atom for every one billion silicon atoms. After the purification process, the silicon enters the melting phase. In this picture you can see how one big crystal is grown from the purified silicon melt. The resulting mono-crystal is called an ingot.
A mono-crystal ingot is produced from electronic grade silicon. One ingot weighs approximately 100 kilograms (or 220 pounds) and has a silicon purity of 99.9999 percent.
The ingot is then moved onto the slicing phase where individual silicon discs, called wafers, are sliced thin. Some ingots can stand higher than five feet. Several different diameters of ingots exist depending on the required wafer size. Today, CPUs are commonly made on 300 mm wafers.
Once cut, the wafers are polished until they have flawless, mirror-smooth surfaces. Intel doesn't produce its own ingots and wafers, and instead purchases manufacturing-ready wafers from third-party companies. Intel's advanced 45 nm High-K/Metal Gate process uses wafers with a diameter of 300 mm (or 12-inches). When Intel first began making chips, it printed circuits on 50 mm (2-inches) wafers. These days, Intel uses 300 mm wafers, resulting in decreased costs per chip.
The blue liquid, depicted above, is a photo resist finish similar to those used in film for photography. The wafer spins during this step to allow an evenly-distributed coating that's smooth and also very thin.
At this stage, the photo-resistant finish is exposed to ultra violet (UV) light. The chemical reaction triggered by the UV light is similar to what happens to film material in a camera the moment you press the shutter button.
Areas of the resist on the wafer that have been exposed to UV light will become soluble. The exposure is done using masks that act like stencils. When used with UV light, masks create the various circuit patterns. The building of a CPU essentially repeats this process over and over until multiple layers are stacked on top of each other.
A lens (middle) reduces the mask's image to a small focal point. The resulting "print" on the wafer is typically four times smaller, linearly, than the mask's pattern.
In the picture we have a representation of what a single transistor would appear like if we could see it with the naked eye. A transistor acts as a switch, controlling the flow of electrical current in a computer chip. Intel researchers have developed transistors so small that they claim roughly 30 million of them could fit on the head of a pin.
After being exposed to UV light, the exposed blue photo resist areas are completely dissolved by a solvent. This reveals a pattern of photo resist made by the mask. The beginnings of transistors, interconnects, and other electrical contacts begin to grow from this point.
The photo resist layer protects wafer material that should not be etched away. Areas that were exposed will be etched away with chemicals.
After the etching, the photo resist is removed and the desired shape becomes visible.
More photo resist (blue) is applied and then re-exposed to UV light. Exposed photo resist is then washed off again before the next step, which is called ion doping. This is the step where ion particles are exposed to the wafer, allowing the silicon to change its chemical properties in a way that allows the CPU to control the flow of electricity.
Through a process called ion implantation (one form of a process called doping) the exposed areas of the silicon wafer are bombarded with ions. Ions are implanted in the silicon wafer to alter the way silicon in these areas conduct electricity. Ions are propelled onto the surface of the wafer at very high velocities. An electrical field accelerates the ions to a speed of over 300,000 km/hour (roughly 185,000 mph)
After the ion implantation, the photo resist will be removed and the material that should have been doped (green) now has alien atoms implanted.
This transistor is close to being finished. Three holes have been etched into the insulation layer (magenta color) above the transistor. These three holes will be filled with copper, which will make up the connections to other transistors.
The wafers are put into a copper sulphate solution at this stage. Copper ions are deposited onto the transistor through a process called electroplating. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer.
The copper ions settle as a thin layer on the wafer surface.
The excess material is polished off leaving a very thin layer of copper.
Multiple metal layers are created to interconnects (think wires) in between the various transistors. How these connections have to be "wired" is determined by the architecture and design teams that develop the functionality of the respective processor (for example, Intel's Core i7 processor). While computer chips look extremely flat, they may actually have over 20 layers to form complex circuitry. If you look at a magnified view of a chip, you will see an intricate network of circuit lines and transistors that look like a futuristic, multi-layered highway system.
This fraction of a ready wafer is being put through a first functionality test. In this stage test patterns are fed into every single chip and the response from the chip monitored and compared to "the right answer."
After tests determine that the wafer has a good yield of functioning processor units, the wafer is cut into pieces (called dies).
The dies that responded with the right answer to the test pattern will be put forward for the next step (packaging). Bad dies are discarded. Several years ago, Intel made key chains out of bad CPU dies.
This is an individual die, which has been cut out in the previous step (slicing). The die shown here is a die of an Intel Core i7 processor.
The substrate, the die, and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be applied. This will keep the processor cool during operation.
A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps and only the most important ones have been visualized in this picture story.
During this final test the processors will be tested for their key characteristics (among the tested characteristics are power dissipation and maximum frequency).
Based on the test result of class testing processors with the same capabilities are put into the same transporting trays. This process is called "binning". Binning determines the maximum operating frequency of a processor, and batches are divided and sold according to stable specifications.
The manufactured and tested processors (again Intel Core i7 processor is shown here) either go to system manufacturers in trays or into retail stores in a box. Many thanks to Intel for supplying the text and photos in this picture story. Check out Intel's site<http://www.intel.com/pressroom/kits/chipmaking/index.htm> for full size images of this entire process.
http://askmanig.com/
http://AskManig.com - Dandruff Treatments!
Dandruff Symptoms
The scales from the scalp fall : When the hair is combed or brushed, or when the scalp is scratched, the scales from the scalp fall like snowflakes and settle on the eye brows, shoulders, and clothes. These scales sometimes appear as lumps or crusts on the scalp.
Itching is there and scalp may become red :Often there is itching as well and the scalp may become red from scratching.
Dandruff Causes
Impairment of general health, wrong food intake, constipation
The main causes of dandruff are impairment of general health, development of a toxic condition mainly due to taking of wrong foods, constipation, and a low vitality due to infectious diseases.
Emotional tension, harsh shampoos, general exhaustion
Other factors contributing to this disorder are emotional tension, harsh shampoos, exposure to cold, and general exhaustion.
Home Remedies for Dandruff
Dandruff treatment using Fenugreek Seeds
The use of fenugreek seeds is one of the most important remedies in the treatment of dandruff. Two tablespoons of these seeds should be soaked overnight in water and ground into a fine paste in the morning. This paste should be applied all over the scalp and left for half an hour. The hair should then be washed thoroughly with soap-nut (ritha) solution or acacia concinna.
Dandruff treatment using Lime
The use of a teaspoon of fresh lime juice for the last rinse, while washing the hair, is another useful remedy. This not only leaves the hair glowing but also removes stickiness and prevents dandruff.
Dandruff treatment using Green Gram Powder
A valuable prescription for removal of dandruff is the use of green gram powder. The hair should be washed twice a week with two tablespoons of this powder mixed with half a cup of curd.
Dandruff treatment using Beet
Beets have been found useful in dandruff. Both tops and roots should be boiled in water and this water should be massaged into the scalp with the finger tips every night. White beet is better for this purpose.
Dandruff treatment using Snake Gourd
The juice of snake gourd has been found beneficial in the prevention and treatment of dandruff. The juice should be rubbed over the scalp for this purpose.
Dandruff treatment using Other Remedies
Dandruff can be removed by massaging the hair for half an hour with curd which has been kept in the open for three days, or with a few drops of lime juice mixed with indian gooseberry juice every night, before going to bed. Another measure which helps to counteract dandruff is to dilute cider vinegar with an equal quantity of water and dab this on to the hair with cotton wool inbetween shampooing. Cider vinegar added to the final rinsing water after shampooing also helps to disperse dandruff.
Dietaries for Dandruff
All-fruit diet with three meala a day of juicy fruits
Diet plays an important role in the treatment of dandruff. To begin with, the patient should resort to an all-fruit diet for about five days and take three meals a day of juicy fruits.
Avoid citrus fruits, bananas, tinned fruits
Citrus fruits, bananas, dried, stewed, or tinned fruits should not be taken.
Well-balanced diet
After the all-fruit diet, the patient can gradually adopt a well-balanced diet, with emphasis on raw foods, especially fresh fruits and vegetables. Further short periods of an all-fruit diet for three days or so may be necessary at monthly intervals till the skin's condition improves.
Avoid strong tea/coffee, pickles, refined and processed foods
Meats, sugar, white flour, strong tea or coffee, condiments, pickles, refined and processed foods should all be avoided.
Other Dandruff treatments
Keep hair and scalp clean to avoid accumulation of dead cells
The foremost consideration in the treatment of this disorder is to keep the hair and scalp clean so as to minimise the accumulation of dead cells.
Hair should be brushed daily to improve circulation
The hair should be brushed daily to improve the circulation and remove any flakiness. The most effective way to brush the hair is to bend forward from the waist with the head down towards the ground, and brush from the nape of the neck towards the top of the head. The scalp should also be thoroughly massaged everyday, using one's finger tips and working systematically over the head. This should be done just before or after brushing the hair. Like brushing, this stimulates the circulation, dislodges dirt and dandruff, and encourages hair growth. Exposure of the head to the rays of the sun is also a useful measure in the treatment of dandruff.
Warm-water enema
During the first five days of the treatment when the patient takes an all-fruit diet, a warm-water enema should be taken daily to cleanse the bowels. Simultaneously, an attempt should be made to keep the body in good health.
How to Cure Dandruff
Dandruff is due to the excessive shedding of dead skin cells from the scalp.
As it is normal for skin cells to die and flake off, a small amount of flaking is normal and in fact quite common.
Some people, however, either chronically or as a result of certain triggers,
experience an unusually large amount of flaking, which can also be accompanied by redness and irritation.
http://askmanig.com/
The scales from the scalp fall : When the hair is combed or brushed, or when the scalp is scratched, the scales from the scalp fall like snowflakes and settle on the eye brows, shoulders, and clothes. These scales sometimes appear as lumps or crusts on the scalp.
Itching is there and scalp may become red :Often there is itching as well and the scalp may become red from scratching.
Dandruff Causes
Impairment of general health, wrong food intake, constipation
The main causes of dandruff are impairment of general health, development of a toxic condition mainly due to taking of wrong foods, constipation, and a low vitality due to infectious diseases.
Emotional tension, harsh shampoos, general exhaustion
Other factors contributing to this disorder are emotional tension, harsh shampoos, exposure to cold, and general exhaustion.
Home Remedies for Dandruff
Dandruff treatment using Fenugreek Seeds
The use of fenugreek seeds is one of the most important remedies in the treatment of dandruff. Two tablespoons of these seeds should be soaked overnight in water and ground into a fine paste in the morning. This paste should be applied all over the scalp and left for half an hour. The hair should then be washed thoroughly with soap-nut (ritha) solution or acacia concinna.
Dandruff treatment using Lime
The use of a teaspoon of fresh lime juice for the last rinse, while washing the hair, is another useful remedy. This not only leaves the hair glowing but also removes stickiness and prevents dandruff.
Dandruff treatment using Green Gram Powder
A valuable prescription for removal of dandruff is the use of green gram powder. The hair should be washed twice a week with two tablespoons of this powder mixed with half a cup of curd.
Dandruff treatment using Beet
Beets have been found useful in dandruff. Both tops and roots should be boiled in water and this water should be massaged into the scalp with the finger tips every night. White beet is better for this purpose.
Dandruff treatment using Snake Gourd
The juice of snake gourd has been found beneficial in the prevention and treatment of dandruff. The juice should be rubbed over the scalp for this purpose.
Dandruff treatment using Other Remedies
Dandruff can be removed by massaging the hair for half an hour with curd which has been kept in the open for three days, or with a few drops of lime juice mixed with indian gooseberry juice every night, before going to bed. Another measure which helps to counteract dandruff is to dilute cider vinegar with an equal quantity of water and dab this on to the hair with cotton wool inbetween shampooing. Cider vinegar added to the final rinsing water after shampooing also helps to disperse dandruff.
Dietaries for Dandruff
All-fruit diet with three meala a day of juicy fruits
Diet plays an important role in the treatment of dandruff. To begin with, the patient should resort to an all-fruit diet for about five days and take three meals a day of juicy fruits.
Avoid citrus fruits, bananas, tinned fruits
Citrus fruits, bananas, dried, stewed, or tinned fruits should not be taken.
Well-balanced diet
After the all-fruit diet, the patient can gradually adopt a well-balanced diet, with emphasis on raw foods, especially fresh fruits and vegetables. Further short periods of an all-fruit diet for three days or so may be necessary at monthly intervals till the skin's condition improves.
Avoid strong tea/coffee, pickles, refined and processed foods
Meats, sugar, white flour, strong tea or coffee, condiments, pickles, refined and processed foods should all be avoided.
Other Dandruff treatments
Keep hair and scalp clean to avoid accumulation of dead cells
The foremost consideration in the treatment of this disorder is to keep the hair and scalp clean so as to minimise the accumulation of dead cells.
Hair should be brushed daily to improve circulation
The hair should be brushed daily to improve the circulation and remove any flakiness. The most effective way to brush the hair is to bend forward from the waist with the head down towards the ground, and brush from the nape of the neck towards the top of the head. The scalp should also be thoroughly massaged everyday, using one's finger tips and working systematically over the head. This should be done just before or after brushing the hair. Like brushing, this stimulates the circulation, dislodges dirt and dandruff, and encourages hair growth. Exposure of the head to the rays of the sun is also a useful measure in the treatment of dandruff.
Warm-water enema
During the first five days of the treatment when the patient takes an all-fruit diet, a warm-water enema should be taken daily to cleanse the bowels. Simultaneously, an attempt should be made to keep the body in good health.
How to Cure Dandruff
Dandruff is due to the excessive shedding of dead skin cells from the scalp.
As it is normal for skin cells to die and flake off, a small amount of flaking is normal and in fact quite common.
Some people, however, either chronically or as a result of certain triggers,
experience an unusually large amount of flaking, which can also be accompanied by redness and irritation.
http://askmanig.com/
Wednesday, October 28, 2009
Askmanig.com
Computer Tricks, Tips , Free Software, Ebooks, Falsh Games, Mobile softwares and mobile games at
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http://askmanig.com/TechTalk/index.php
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http://askmanig.com/TechTalk/index.php
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